Podcast: Intel Chiplet Technology, T-Mobile, Sprint, Dish and 5G Carriers

This week’s Tech.pinions podcast features Tim Bajarin and Bob O’Donnell discussing some of the latest semiconductor packaging technology announcements from Intel and what they mean for the overall evolution of “chiplets” and the semiconductor industry in general, and debating the potential impact of Dish’s involvement with a potential merger between T-Mobile and Sprint and what it says about the current state of 5G networks in the US.

If you happen to use a podcast aggregator or want to add it to iTunes manually the feed to our podcast is: techpinions.com/feed/podcast

Published by

Bob O'Donnell

Bob O’Donnell is the president and chief analyst of TECHnalysis Research, LLC a technology consulting and market research firm that provides strategic consulting and market research services to the technology industry and professional financial community. You can follow him on Twitter @bobodtech.

1,198 thoughts on “Podcast: Intel Chiplet Technology, T-Mobile, Sprint, Dish and 5G Carriers”

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