Podcast: Intel Chiplet Technology, T-Mobile, Sprint, Dish and 5G Carriers

on July 13, 2019

This week’s Tech.pinions podcast features Tim Bajarin and Bob O’Donnell discussing some of the latest semiconductor packaging technology announcements from Intel and what they mean for the overall evolution of “chiplets” and the semiconductor industry in general, and debating the potential impact of Dish’s involvement with a potential merger between T-Mobile and Sprint and what it says about the current state of 5G networks in the US.

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